TDK to Showcase Solutions for Automotive, IoT, AR/VR, and Consumer Electronics at Sensors Expo & Conference 2019

  • TDK Corporation to highlight industry’s most comprehensive portfolio
    of sensors and passive components from brands including TDK, EPCOS,
    InvenSense, Micronas, Chirp, and Tronics.
  • Solutions address real-world applications such as AR/VR, robotics,
    IoT, automotive, consumer electronics, and sound systems.

SAN JOSE, Calif.–(BUSINESS WIRE)–TDK Corporation (TSE: 6762) will present the industry’s single source of
innovative sensor solutions marketed under brands TDK, EPCOS,
InvenSense, Micronas, Chirp, and Tronics in Booth #416 at Sensors
Expo and Conference 2019
, McEnery Convention Center, June 26-27, San
Jose, Calif. TDK will also present at the Sensors Expo Pre-Symposium on
June 25.

TDK’s portfolio meets the growing and diverse demand for sensor
technologies in the automotive, industrial equipment, consumer
electronics industries and beyond.

The exhibition will include the following sensor solutions:

TMR-based
Current Sensors
: The first Micronas TMR-based sensor
family CUR 42xy was developed for current measurements in Automotive and
Industrial applications and is marketed under the trademark curSENS. The
CUR 423x sensors allow for non-intrusive, galvanically isolated
contactless current measurements based on closed-loop TMR technology.
The sensors are ISO26262 ASIL-B ready and AEC-Q100 qualified. A very
good signal-to-noise ratio and a total error below 1% (full scale) over
temperature enable precise current measurements and the smallest module
integration since no magnetic-field core concentrator is required.

TMR
Angle Sensors
: The TDK TMR angle sensor, TAD2141 with
digital output, offers a guaranteed accuracy of ±0.2°. At room
temperature, the sensor achieves an accuracy for angle error of only
±0.05°. The sensor is capable of contactless sensing 360° within a
temperature range of -40 °C to +150 °C. The main applications of the
sensor include industrial and robotics, as well as automotive with a
focus on future systems for automated driving.

Direct
Angle Sensors
: The Micronas Hall-sensor family HAL® 39xy
featuring stray-field compensation capability was built on the highly
flexible architecture for multidimensional magnetic-field measurements,
marketed under the trademark masterHAL®. It offers four
different measurement modes in a single device: linear position
detection, rotary 360° angle detection and rotary 180° angle detection
with stray field compensation including gradient fields as well as the
capability for real 3D magnetic field measurement (BX, BY, BZ).

MEMS
Gyroscopes
: The Tronics GYPRO® high-performance MEMS gyroscopes
product line has been specifically designed for applications that are
more demanding than automotive, while not requiring “tactical grade” FOG
(Fiber Optic Gyros) or DTG (Dynamically Tuned Gyros). GYPRO® offers high
bias stability, low noise and low latency. Tronics’s closed-loop
gyroscopes product family is ideal for precision navigation and
stabilization applications.

MEMS
Accelerometers
: The Tronics AXO® high-performance MEMS
accelerometers take MEMS acceleration sensors to a new level of
performance thanks to their closed-loop architecture. Tronics AXO®
complements the industry-standard GYPRO® product line. It offers low
noise, high bias stability and excellent linearity over temperature, and
is well suited to precision navigation applications.

BioMEMS:
Tronics customizable BioMEMS products include flexible polymer based
sensors, conductive and functionalized silicon microneedles, and
microfluidic sensors for use in the medical wearable, point of care, and
diagnostic markets. Devices are fabricated in an ISO 9001:2017 and ISO
13485:2016 certified US based cleanroom.

Temperature
and
Pressure
Sensors:
High-accuracy temperature and pressure sensors with
excellent media resistance and long-term stability, serving the
automotive, industrial and consumer electronics markets. The EPCOS H650
temperature sensor element is designed for measuring temperatures up to
650 °C. The NTC sensor element offers high-precision measurement with a
temperature tolerance of about ±1 K at 200 °C. New high performance and
long-term stable EPCOS pressure sensing elements are designed for
pressure ranges of 100 mbar up to 40 bar; down to a size of 0.65 mm x
0.65 mm.

MEMS
Microphones
: TDK and InvenSense microphones fit in all
mobile, IoT, and wearable solutions where low power, high fidelity,
tight sensitivity matching and high acoustic overload point (AOP) are
important. Multi-mode microphones are ideal in ‘AlwaysOn’ applications
where the current consumption is significantly reduced in low-power
mode. InvenSense is the only company offering a high SNR and AOP
multi-mode solution for both analog (ICS-40618/40619) and digital
(ICS-41350) microphones.

Ultrasonic
ToF Sensors
: The Chirp CH-101 is the first commercially
available MEMS-based ultrasonic time of flight (ToF) sensors intended
for consumer electronics, AR/VR, robotics, drones, IoT, automotive, and
industrial market segments. The Chirp Microsystems ultrasonic product
portfolio also includes the CH-201 ultrasonic ToF sensor and Chirp’s
SonicTrack™, an ultrasonic six-degree-of-freedom (6-DoF) sensor fusion
library to make inside-out 6-DoF tracking available.

MEMS
Motion Sensors
: Accurately tracking complex user motions require
the use of motion sensors such as gyroscopes, accelerometers, compasses,
and pressure sensors, fusing the sensor outputs into a single and
accurate data stream for use as input commands in consumer, industrial,
and automotive solutions. InvenSense’s latest chip, the ICM-42605 is a
6-axis MotionTracking device that combines a 3-axis gyroscope and 3-axis
accelerometer, in a small 2.5 x 3 x 0.91mm (14-pin LGA) package. A
comprehensive development platform is also available for ICM-42605 to
help customers evaluate and develop applications. Similarly, the
IAM-20680 is also a 6-axis MotionTracking device designed specifically
for automotive applications; it combines a 3-axis gyroscope, and a
3-axis accelerometer in a small, 3mm x 3mm x 0.75mm (16-pin LGA)
package. The IAM-20680, with its 6-axis integration, enables
manufacturers to eliminate the costly and complex selection,
qualification, and system level integration of discrete devices,
guaranteeing optimal motion performance.

Dr. Sreeni Rao, senior director, Gas and Environmental Sensing at TDK,
will present at the Sensors Expo Pre-Symposium on real-world
applications for MEMs and sensors on June 25. From 9:15-10 a.m. PST, Dr.
Rao will discuss gas sensing technology advances for at-home and
consumer healthcare applications.

—–

About TDK Corporation

TDK Corporation is a leading electronics company based in Tokyo, Japan.
It was established in 1935 to commercialize ferrite, a key material in
electronic and magnetic products. TDK’s comprehensive portfolio features
passive components such as ceramic, aluminum electrolytic and film
capacitors, as well as magnetics, high-frequency, and piezo and
protection devices. The product spectrum also includes sensors and
sensor systems such as temperature and pressure, magnetic, and MEMS
sensors. In addition, TDK provides power supplies and energy devices,
magnetic heads and more. These products are marketed under the product
brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda. TDK
focuses on demanding markets in the areas of information and
communication technology and automotive, industrial and consumer
electronics. The company has a network of design and manufacturing
locations and sales offices in Asia, Europe, and in North and South
America. In fiscal 2019, TDK posted total sales of USD 12.5 billion and
employed about 105,000 people worldwide.

Contacts

TDK
Ms. Sara M. LAMBETH
TDK Corporation of America
Richardson,
TX
+1 972-409-4519
sara.lambeth@us.tdk.com

TDK
Ms. Kim LIANTHAMANI
Karbo Communications
San
Francisco, CA
+1 415-255-6512
TDKUSA@karbocom.com

EPCOS
Ms. Debbie MARTIN
TDK Electronics Inc.
Fountain
Hills, AZ
+1 732-906-4364
debbie.martin@tdk-electronics.tdk.com

InvenSense/Chirp
Mr. David A. ALMOSLINO
InvenSense/Chirp
Microsystems
San Jose, CA
+1 408-501-2278
pr@invensense.com

Micronas
Ms. Julia ANDRIS
TDK-Micronas
Freiburg,
Germany
+49 761 517 2531
media@micronas.com

Tronics
Mr. Karl BIASIO
Tronics Microsystems
Crolles,
France
+33 (0)4 76 97 94 59
karl.biasio@tronicsgroup.com

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